Spatially dense integration of micron-scale devices from multiple materials on a single chip via transfer-printing

The heterogeneous integration of devices from multiple material platforms onto a single chip is demonstrated using transfer-printing (TP) technique. Serial printing in spatially dense arrangements requires that subsequent processes do not disturb previously printed components, even the case where print head contact with those devices. In this manuscript we show deterministic components within footprint order device size, including AlGaAs, diamond and GaN waveguide resonators integrated chip. semiconductor nanowire (NW) GaAs/AlGaAs InP lasers also to spacing 1 ? m range.